Nanyu Zeng, Taesung Jung, Mohit Sharma, Guy Eichler, Jason Fabbri, R. James Cotton, Eleonora Spinazzi, Brett Youngerman, Luca Carloni and Kenneth L. Shepard A Wireless, Mechanically Flexible, 25μμm-Thick, 65,536-Channel Subdural Surface Recording and Stimulating Microelectrode Array with Integrated Antennas. 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).

This paper presents a fully wireless microelectrode array (MEA) system-on-chip (SoC) with 65,536 electrodes for non-penetrative cortical recording and stimulation, featuring a total sensing area of 6.8mm×7.4mm with a 26.5μm×29μm electrode pitch. Sensing, data telemetry, and powering are monolithically integrated on a single chip, which is made mechanically flexible to conform to the surface of the brain by substrate removal to a total thickness of 25μm allowing it to be contained entirely in the subdural space under the skull.